CS-3 System
Revolutionary AI Infrastructure
From power and cooling to packaging and data delivery, every detail of the CS-3 is optimized for AI workloads.
900,000
AI-Optimized Cores
123x more cores
21PB/s
Memory Bandwidth
12,800x more bandwidth
44GB
On-Chip SRAM
1,000x more on-chip memory
1.2Tb/s
System I/O
214Pb/s
Interconnect Bandwidth
45,000x more bandwidth
16RU
System Dimensions
Cluster-Scale Power
Mini-Fridge Size
At the heart of the CS-3 system is an innovative wafer packaging solution we refer to as the engine block. The engine block delivers power straight into the face of the wafer to achieve the required power density that could not be achieved with traditional packaging. It provides uniform cooling for the wafer via a closed internal water loop. All cooling and power supplies are redundant and hot-swappable so you stay up-and-running at full performance.
Massive Performance,
Minimal Footprint
In one system less than one rack in size, the CS-3 delivers answers in minutes or hours that would take days, weeks, or longer on large multi-rack clusters of legacy, general purpose processors.
1/3
power savings
72X
processing power vs. gpus
Seamless Integration
Designed for rapid deployment, the CS-3 installs in days, not weeks or months. It seamlessly connects to existing infrastructure via 12x standard 100 Gigabit Ethernet links, translating standard TCP-IP traffic into Cerebras protocol at full line rate to drive its 900,000 cores.
